Inspection is possible only on the surface of the double-sided implementation substrate! Also compatible with 3D tomography inspection. *Detailed explanatory materials will be provided.
The "ILX-1000/2000" is an inline X-ray inspection device that automatically inspects the soldering areas of mounted circuit boards. Thanks to our unique inspection method, it supports separate inspections of the front and back surfaces of the circuit board. It is not affected by the back side of double-sided mounted boards. Additionally, 3D tomography inspection is also possible. It is suitable for inspecting soldering areas of BGA/CSP components and components like QFN/SON that have soldering on the bottom surface. 【Features】 ■ Capable of inspecting bottom-soldered components such as BGA ■ Can cancel out components on the back side of the board for inspection ■ Supports small boards (50×50mm) to large sizes (510×460mm) ■ Compact and space-saving, suitable for inline use *We are currently offering detailed materials that explain the product. Please refer to those for more information.
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【Specifications】 ■Inspection Method: 2D Transmission Inspection, 3D Stereo Inspection, 3D Tomography Inspection (Optional) ■X-ray Tube Type: Microfocus Sealed Source (Sealed Type) ■X-ray Tube Voltage: (ILX-1000) 20 - 90kV / (ILX-2000) 40 - 130kV ■X-ray Focus Diameter: 5μm ■Board Size/Inspection Area: 50×50 to 510×460mm ■X-Y Axis Stroke: X-axis: 600mm, Y-axis: 600mm ■Component Height: 25mm above the board, 25mm below the board ■Board Transport Width: 3mm ■Board Thickness: T = 0.8 to 2.0mm ■Display: 24-inch LCD ■Power Supply: Three-phase AC 200V, 3kVA ■Device Dimensions: 1,250(w) × 1,350(d) × 1,400(h) ■Device Weight: (ILX-1000) 1,000kg / (ILX-2000) 1,200kg *We are currently offering detailed materials explaining the product. Please refer to those for more information.
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