3D stereo inline X-ray inspection device ILX-1100/2000

The cost reduction of inline automatic inspection has been achieved through the 3D X-ray stereo method!

This product is an inline inspection device that automatically inspects the solder joints of mounted circuit boards using X-rays. In high-density circuit boards, the solder joints are located on the bottom surface of the components (face down), making visual inspection impossible. It is suitable for inspecting components like QFN/SON, where the solder joints are on the bottom surface of the components. 【Features】 - Safe design, no qualifications required for handling X-rays - Compact and space-saving, enabling inline X-ray inspection - Can inspect without being affected by the backside of double-sided mounted circuit boards - Capable of 3D tomographic inspection using X-ray stereo method - Supports small circuit boards (50×50mm) to large sizes (510×460mm) - Capable of inspecting bottom-soldered components like BGA using X-ray stereo method *For more details, please refer to the PDF materials or feel free to contact us.

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