Introduction to Silicon Etching Processing Technology

By selecting the type of crystal orientation, you can choose the type of groove processing!

"Silicon etching" is a processing technology that corrodes the silicon substrate itself to form three-dimensional structures. There are two types of silicon corrosion: one that progresses in a specific direction (anisotropic) and one that progresses in all directions (isotropic). When performing anisotropic etching, single-crystal silicon is used for the substrate, and an etching solution such as KOH aqueous solution is employed. Single-crystal silicon wafers are categorized by crystal direction, and by selecting this, it is possible to choose the type of groove processing. Additionally, isotropic etching can also be performed depending on the type of etching solution used. [Features] - Corrodes the silicon substrate itself to form three-dimensional structures - Allows selection of groove processing types by choosing the type of crystal direction - Isotropic etching is possible depending on the type of etching solution *For more details, please refer to the catalog or feel free to contact us.

Technology Development