Introduction to Reliability Assurance Services

I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.

At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.

Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, allowing us to capture and monitor the operational status, such as screen displays, during the tests. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects with loggers (for voltage, current, resistance, temperature, etc.) is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the test equipment.

We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using a strain gauge. It was observed that the material expands when it absorbs moisture due to humidification, contracts when it dries due to dehumidification, and the strain returns to the state before humidification. Regarding FR-1, it is presumed that the chemical structure of the material changed due to hydrolysis, which is why it did not return to its original state.