Widely customizable CMP slurry
CMP (Chemical Mechanical Polishing) slurry is used in the semiconductor manufacturing process to polish the surface of substrates. Chemical etching softens the material, and mechanical abrasion removes the material, resulting in the flattening of the original three-dimensional shape. This is the mechanism of CMP. Our CMP slurry has a proven track record for various applications, including copper wiring for semiconductor circuit miniaturization and speed enhancement, low-temperature sputtering for cost-effective aluminum wiring, and compounds that excel in high-speed signal processing. It is composed of a chemical reaction solution and nano-sized polishing particles, characterized by minimal generation of coarse particles and sedimentation, ensuring stable quality. *Please feel free to contact us.*
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basic information
【Features】 ■ Stable quality with minimal generation of large particles and sedimentation of particles ■ Technical support provided by knowledgeable and experienced application engineers ■ Guidance tailored to specific applications *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.
![[Research Material] Global Market for CMP Polishing Materials](https://image.mono.ipros.com/public/product/image/57d/2000829785/IPROS99181004977097042459.jpeg?w=280&h=280)
