Semiconductor device
This is a semiconductor device made from A5052P (aluminum material) with a thickness of 1.0mm and 1.5mm. The product in the photo is assembled from nine individually manufactured aluminum parts. The parts undergo processes of cutting, pre-processing, and bending, followed by anodizing treatment.
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basic information
Material: A5052P / t=1.0, t=1.5 Dimensions: 150 × 400 × 300 Process: Precision sheet metal processing Application: Semiconductor equipment
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Applications/Examples of results
This product is used as part of a semiconductor device.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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