New Type Spin Scrub Automatic Cleaning Device (Post-CMP and Post-Polishing Cleaning)

High-reliability automatic scrub cleaning device for mass production sites

■ Optimized for mass production sites as "post-CMP and post-polishing cleaning," "incoming cleaning," and "final cleaning" ■ Capable of handling "resist removal" adhered during mask contact exposure ■ Proven performance with a 2-chamber configuration supporting 1.8 minutes per sheet ■ Options available for "inversion function," "brush pressure setting function," "CO2 ionizer," etc. ■ High-pressure jet and DIW two-fluid systems address bevel area contamination ■ Basic concept is contamination-free on the backside ◎ Vacuum chucks are generally not used due to contamination at the contact area ◎ Backside rinse function is standardly equipped. * For more details, please download the PDF document or feel free to contact us. * Please also refer to the catalog for similar models of "photo mask cleaning machines." Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductor, resist stripping equipment, megasonic, substrate cleaning equipment, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer cleaning equipment, wafer cleaning machines, transport equipment.

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