Flux-free reflow device for fine wafer bumps. Sample test compatible, achieving energy-saving and short takt processes. Reflow video available.
Achieving flux-free bump reflow with highly reducing H2 radicals generated by high-density plasma (SWP). Reducing the application and cleaning processes of flux. Minimizing wet processes before and after reflow. An energy-saving, space-saving, and clean process that reduces the space, processing, and utilities of wet equipment. A cutting-edge mass production process compatible with 300mm wafers, suitable for batch-type hardware and niche devices with small-diameter substrates. Supporting short-tact batch processing for small-lot production and R&D applications.
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basic information
Batch type compatible with φ300mm wafers High-density damage-free radical treatment using surface wave plasma (SWP) Equipped with rapid temperature rising and falling hot plate Achieves voidless bumps through vacuum processes Supports resist ashing as an option Currently accommodating sample testing
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Delivery Time
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Applications/Examples of results
Compound IC Wafer Bump Flow MEMS Device Bump Flow Optical Device (LED, LD, Photodetector) Bump Flow Optical Module Bump Flow
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| Model number | overview |
|---|---|
| CtoC Type | Mass production compatible plasma flow device |
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
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