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  6. Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

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CtoC type plasma reflow device

last updated:May 13, 2020

神港精機 東京支店
神港精機 東京支店
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Fluxless wafer bump reflow device. Achieves fine bump reflow without wet processes. Sample demo available. Reflow video posted.

Fluxless reflow in a strong reducing H2 radical atmosphere of damage-free downflow-type surface wave plasma, reducing flux application and cleaning processes, as well as application and cleaning equipment. A completely dry CtoC system. Achieving a short tact reflow process for fine pitch bumps.

    Other semiconductor manufacturing equipment
プラズマリフロー.jpg

Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

プラズマリフロー.jpg
プラズマリフロー.jpg plashoriari.jpg
  • Related Link - http://www.shinko-seiki.con/
  • Special site - Product/service details - https://pr.mono.ipros.com/shinko-seiki/product/

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basic information

Charge-up damage-free process. Highly reliable and stable transport mechanism. Reflow temperature profile on a 300mm wafer with uniform temperature distribution. Supports full-scale mass production lines for 300mm wafers. Compatible with various upper communication standards, SMIFF pods, etc. Consistent team support from testing to design, delivery, and startup.

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Applications/Examples of results

Wafer bump reflow Fine bump reflow on large substrates 300mm wafer single-sheet low-temperature annealing

Detailed information

  • kouteisakugen.gif

    Illustration of the effect of process reduction for plasma flow devices.

  • insatubamp.gif

    Illustration for print bump support

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Model number overview
Batch-type plasma flow device Batch type compatible with 300mm wafers, deploying cutting-edge processes for niche devices. For R&D and small-scale production.

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Company information

神港精機

神港精機 東京支店

Industrial Machinery

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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.

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