Laser microfabrication: trimming process SUS304 laser cutting
【Microfabrication Trimming Processing SUS304 Laser Cutting】 【Material】 SUS304 【Material Dimensions】 Thickness 0.05mm Cut Width 0.1mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product features cut-out processing of SUS304 material. It has undergone microfabrication with a cut width of 0.1mm, and we can also accommodate trimming of irregular shapes. By using ultrashort pulse lasers, we have significantly reduced physical damage and thermal effects, enabling fine processing with minimal burrs. ◆ Microfabrication of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
Inquire About This Product
basic information
【Microprocessing Trimming Processing SUS304 Laser Cutting】 【Material】 SUS304 【Material Dimensions】 Thickness 0.05mm Cut Width 0.1mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product features cut-out processing of SUS304 material. It has undergone microprocessing with a cut width of 0.1mm, and we can also accommodate trimming of irregular shapes. By using ultrashort pulse lasers, we have achieved microprocessing with minimal physical damage and thermal effects, resulting in less burr. ◆ Microprocessing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
Price range
Delivery Time
Applications/Examples of results
【Microfabrication Trimming Processing SUS304 Laser Cutting】 【Material】 SUS304 【Material Dimensions】 Thickness 0.05mm Cut Width 0.1mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product features cut-out processing of SUS304 material. It has undergone microfabrication with a cut width of 0.1mm, and we can also accommodate trimming of various shapes. By using ultrashort pulse lasers, we have minimized physical damage and thermal effects, resulting in fine processing with minimal burrs. ◆ Microfabrication of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
catalog（4）
Download All Catalogs
Company information
At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
