Mass production compatible batch-type sputtering system (Model STH10311)

A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.

This is a batch-type sputtering device that achieves both processing capacity for mass production and excellent film thickness uniformity by adopting multiple self-rotation substrate stages. Despite being a chamber system exceeding 1 meter due to the side sputtering method, it enables easy attachment and detachment of substrates and targets, as well as simplified maintenance within the vacuum chamber. It incorporates essential considerations for mass production equipment, such as a data logging system optimal for mass production and control interface software that facilitates device control and management. It balances quality and throughput for large substrates represented by 300 mm wafers, as well as for the mass production of small electronic components like resistors and sensors.

Sputtering Equipment