Implementation of ultra-small solder balls is possible! Solder balls can be directly mounted on the flux of the PCB surface electrodes!
We would like to introduce the solder ball mounting process technology of Niigata Seimitsu Co., Ltd. The solder ball mounting process supports both bulk mounting and single mounting types, and can also accommodate reballing. Additionally, we can comprehensively handle other processes related to the solder ball mounting process, such as PCB dicing and pickup, all in-house. 【Features】 ■ Flux is printed on the electrodes of the printed circuit board (PCB) surface. ■ Solder balls are directly mounted on the flux on the PCB surface electrodes. ■ Method for mounting solder balls. ■ Compatible with lead-free solder. ■ Capable of mounting ultra-small solder balls for pre-solder applications. *For more details, please refer to the PDF materials or feel free to contact us.
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【Specifications (Excerpt)】 〈Bulk Mounting Type〉 ■ Ball Size ・φ0.08 to φ1.0mm, lead-free solder (Other sizes, special balls, solder compositions, etc. are negotiable) ■ Board Size ・Max: 240(L) × 110(W)mm (Substrate board size) or 8-inch wafer size ・Min: Usable with transport carriers, etc. 〈Single Mounting Type〉 ■ Ball Size ・φ0.2 to φ0.76mm, lead-free solder (Other sizes, special balls, solder compositions, etc. are negotiable) ■ Board Size ・Max: 200mm or 8-inch wafer size ・Min: Usable with transport carriers, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.
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