Supports low to high viscosity resist! Can produce semi-automatic machines for any wafer size!
This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have realized the production of semi-automatic machines at low prices for customers who cannot afford to buy fully automatic machines or for those who do not need a fully automatic machine for small lots! We have a proven track record with a variety of chemicals including positive-negative resists, polyimides, SOG, wax, and silicones. We also have extensive experience in substrate transport for various materials such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, and ceramics, as well as SiO2 (glass). 【Features】 ■ Achieves low cost with semi-automatic resist coating machines ■ Compatible with substrates from 2 to 12 inches ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Proven track record with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Spin Coating Unit: 1 set ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 2 sets ■ Bake Unit: 2 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
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