Effective in reducing polyimide and expensive high-viscosity resists! It is a rotary cup-type spin coater.
The rotating cup-type spin coater can significantly reduce the amount of high-viscosity materials (such as polyimide and high-viscosity resist) used! Thanks to our patented technology, we have successfully reduced usage by evenly spreading the minimum amount of liquid at low rotation speeds. The extent of reduction varies depending on the liquid, but we have achieved reductions of 30% to 70% in usage. We offer a lineup ranging from manual machines to fully automatic machines to match production volumes. Since we handle everything from design to manufacturing and sales in-house, we have achieved improved customization and lower prices. We have a proven track record with a variety of liquids, including polyimide, SOG, WAX, and silicone. We have permanent demo equipment available, so if you're interested, please request a demo or contact us. 【Features】 ■ Achieves low prices ■ High customization ■ Automatic size recognition ■ Proven track record with a variety of liquids ■ Reduced footprint ■ Numerous options for resist reduction ■ Lineup tailored to production volume *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 2 sets ■Wafer Size: Φ2" to Φ12" ■Resist Dropping Nozzle: 2 sets ■Bake Unit: 2 sets (Max 200℃) ■Cooling Unit: 1 set ■Centering Unit: 1 set ■Device Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
