We have extensive experience (know-how) in the transport and coating of fragile and thin wafers such as GaAs, LT, and glass!
What concerns us about thin wafers are breakage during transport and in-plane uniformity after coating. We have confidence in transporting thin and fragile wafers, as evidenced by our track record in manufacturing wafer transport devices (wafer sorters). We can accommodate a wide range of substrates including GaAs, LT (lithium tantalate), glass (quartz), GaN, sapphire, Si, and ceramics. Additionally, thin wafers tend to have variability in in-plane uniformity during coating, but this can be significantly improved by innovating the chuck and other components. Our product comes standard with spin coating, HMDS treatment, baking, and cooling functions. Depending on customer requirements and production volume, we can adjust the number of units and offer options from manual machines to fully automated systems. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Robot compatible with thin wafers ■ Chuck compatible with thin wafers ■ Achieves low prices ■ Automatic recognition of wafer sizes ■ Proven performance with a variety of chemicals ■ Reduced footprint ■ Numerous options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Main Specifications】 ■Cassette Stage: 2 sets ■Spin Coating Unit: 2 sets ■Wafer Size: Φ2" to Φ12" ■Resist Dropping Nozzle: 2 sets ■Bake Unit: 2 sets (Max 200℃) ■Cooling Unit: 1 set ■Centering Unit: 1 set ■Device Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
It is compatible with a variety of substrates including GaAs, LT (lithium tantalate), glass (quartz), GaN, sapphire, Si, and ceramics. *For more details, please feel free to contact us.*
catalog（1）
Download All Catalogs
Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.