We can create a device that accommodates both the current wafer size and the wafer size you wish to use in the future (e.g., 2-4 inches, 6-8 inches, etc.).
Devices that can accommodate two or more wafer sizes can be produced without any setup changes. Examples of achievements: ■ 2/3/4 inch compatible devices ■ 4/5 inch compatible devices ■ 4/6 inch compatible devices ■ 6/8 inch compatible devices ■ 8/12 inch compatible devices Since it also varies depending on wafer weight and material, please feel free to consult us first. If you consider installing one dedicated device for each of the two wafer sizes, the installation area will effectively be halved! Of course, spin coating, HMDS treatment, baking, and cooling functions are standard features. We offer a lineup tailored to production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Compatibility with multiple inch size wafers (no setup changes) ■ Automatic operation with automatic wafer size recognition ■ Achieved low prices ■ Proven results with a variety of chemicals ■ Reduced footprint ■ Numerous options with resist reduction ■ Lineup tailored to production volume *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
**Main Specifications** - Cassette Stage: 2 sets - Spin Coating Unit: 2 sets - Wafer Size: Φ2" to Φ12" - Resist Dropping Nozzle: 2 sets - Bake Unit: 2 sets (Max 200℃) - Cooling Unit: 1 set - Centering Unit: 1 set - Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) - Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.*
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
We have a track record in various fields such as power devices, LEDs, LDs, and SAW filters. *For more details, please feel free to contact us.*
catalog（1）
Download All Catalogs
Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
![[Case Study] Bonding with Hot Melt to Shrink with Liner](https://image.mono.ipros.com/public/product/image/0ad/2000717396/IPROS31213763404982728059.jpeg?w=280&h=280)
