Compact the device size as much as possible! Achieve stable film formation and low particle count.
The "A200V" is a single-wafer atmospheric pressure CVD system compatible with φ150 and φ200 mm wafers, covering production from small quantities of diverse products to mass production. By adopting a face-down film formation method, it demonstrates excellent film thickness uniformity, particle control, and embedding performance, depositing silicon oxide films based on SiH4. Additionally, the system can also support options for TEOS-O3 and SiH4-O3. 【Features】 ■ Face-down position ■ Compact device design and configuration ■ Balancing maintainability and high productivity ■ Excellent film thickness uniformity and embedding capability ■ Ensures safety by preventing operators from directly contacting the heating area *For more details, please refer to the PDF materials or feel free to contact us.
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【Specifications (Partial)】 ■Size: 890mm(W) × 2300mm(D) × 2250mm(H) ■Film Thickness Uniformity: ≦±2% (in-plane, between planes) ■Temperature: 300℃ to 450℃ (150℃ to 350℃ for ozone process) ■Compatible Wafer Size: Up to 8 inches ■Throughput (Reference Value): 14 wafers/hour (during 500nm film deposition) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Amaya Manufacturing Co., Ltd. has been developing and selling atmospheric pressure CVD (Chemical Vapor Deposition) equipment since 1970, focusing on atmospheric pressure CVD systems used for semiconductor manufacturing. In recent years, as a challenge to enter new fields, we have developed and sold high productivity atmospheric pressure CVD equipment for solar cell manufacturing. Moving forward, we will continue to work on developing new technologies and aim to be the only company specializing in atmospheric pressure CVD equipment.
