X-ray fluoroscopy and CT examination device: BGA solder crack analysis case study

X-ray fluoroscopy observation, oblique CT observation, orthogonal CT observation, etc.! Introduction of BGA solder crack analysis cases.

We will introduce a case study of BGA solder crack analysis using X-ray imaging and CT scanning. When observing the BGA connection area of a circuit board that had become electrically open using X-ray imaging, cracks were confirmed to have occurred at the BGA connection. Additionally, we examined the cracks in the solder connection area identified through X-ray imaging using oblique CT. Oblique CT provides clear planar information, but spherical shapes like solder balls and voids appear elongated in the vertical direction due to specific factors of oblique CT. While it is difficult to obtain cross-sectional information about the cracks occurring at the solder joint interface, there is the advantage of being able to observe the circuit board non-destructively. [Analysis Cases] ■ X-ray imaging observation ■ Oblique CT observation ■ Orthogonal CT observation ■ Cross-sectional observation *For more details, please refer to the PDF document or feel free to contact us.

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