Fully automatic lithography system for automatic coating, exposure, and development process.
Coating the resist, exposure, and developing process are all done in one go. It is a device that can process automatically. This is a special device made possible by being a comprehensive manufacturer of photolithography equipment.
This product is a device that automatically performs spin coating, batch exposure, and development processing. It can be equipped with HMDS treatment, baking, and cooling functions. This device has been made possible because our company handles everything from design to manufacturing and sales, offering a lineup of photolithography equipment including coaters, aligners, and developers. The supported resists include positive and negative resists, polyimide, and various other chemicals have been successfully used. We also have extensive experience in transporting a wide range of substrates such as Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, and SiO2 (glass). The exposure process can be equipped with an auto-alignment function, making it ideal for positive-negative inversion processes as well. 【Features】 ■ Automatic batch processing of photolithography steps ■ Achieves low cost ■ Compatible with low to high viscosity (1.7cP to 10000cP) ■ Supports sizes from 2 to 6 inches, with proven capability for 4-inch ■ Automatic recognition of wafer sizes ■ Proven results with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options for resist reduction ■ Each process can operate independently ■ Auto-alignment function *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■Cassette Stage: 1 set ■Spin Coating Unit: 1 set ■Spin Development Unit: 1 set ■Wafer Size: Φ2" to Φ6", □4 inches also acceptable ■Resist Dropping Nozzle: 1 set ■Back Edge Rinse: 1 set per Coating CUP ■Development Nozzle: 1 set ■Rinse Nozzle: 1 set ■Bake Unit: 3 sets (Max 200℃) ■Cooling Unit: 2 sets ■Centering Unit with Automatic Alignment Function: 1 set ■Exposure Unit: 1 set ■Exposure Light Source: Ultra High Pressure Mercury Lamp (250W, 500W), UV-LED light source also compatible ■Auto Alignment Function Equipped (by FAST Corporation) ■Device Size: (Example) 1650×1350×1800 (Φ4" main body) 3000×1500×1800 (□4" main body) ■Wafer Transport Robot: 1 set (Self-driving double-arm clean robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※5 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
