New type UDS spin sheet device (etching, RCA, cleaning, developing, etc.)

Significant reduction in footprint and purchase costs, increased throughput, and substantial improvement in substrate quality.

- Suitable for various WET processes such as etching, RCA cleaning, and developing. - A full process of "chemical solution ⇒ rinse ⇒ drying" is handled in a single chamber with Dry-In/Dry-Out. - Conventional method: 2-chamber configuration (the substrate remains in contact with the chemical solution during transfer between chambers). - New method: UDS type uses a 1-chamber configuration. - Basic operation of the substrate: - "Upper section… Substrate LD" ⇒ "Lower section… Chemical treatment" ⇒ - "Middle section… Rinse drying" ⇒ "Upper section… Substrate ULD" - The patented isolation plate ensures the concentration of the chemical solution during reuse. - There is no dilution from rinse water contamination. - For example, it can accommodate "Lower section… SPM treatment" and "Middle section… APM/MS." - The patented isolation plate completely separates and prevents the scattering of chemical gases and mists in the lower treatment section. - Chemical solution/rinse treatment can be performed on the backside of the substrate, ensuring it is contamination-free. - Shortening the manufacturing process significantly increases production efficiency and can greatly reduce cleanroom occupancy area. - A seamless process of etching ⇒ stripping is possible within a single system device. *For more details, please refer to the PDF document or feel free to contact us.*

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