A compact heat treatment device characterized by rapid temperature rise and fall. It is an ideal compact vacuum heat treatment device for low-temperature heat treatment such as drying, degassing, and baking of organic substrates.
Application of the basic configuration of a vacuum soldering device with a proven track record. High-speed heat treatment using a heated plate for soldering. Degassing and drying of high-density mounting substrates and printed boards before film formation. Ideal for various applications such as drying ceramic materials. Effective for low-temperature baking of solar cell cells and annealing of thin films, also compatible with inline processes.
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basic information
Supports processing of 300mm square substrates with a rapid heating hot plate. Achieves short time and short cycle processing through a substrate cooling mechanism. Provides a stable heating process for substrates that are prone to damage from prolonged heating. System upgrade to inline type is easy based on evaluations of the standard batch type.
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Applications/Examples of results
Multilayer printed circuit board baking Small FPD substrate annealing Thin-film solar cell annealing and baking Ceramic fiber drying
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
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