It is equipped with transfer functionality and thickness measurement functionality.
This is a wafer thickness measurement device equipped with transfer and thickness measurement functions. It is capable of measuring the thickness at each point within the specified wafer. It supports 6-inch and 8-inch wafers. 【Features】 ■ Equipped with transfer and thickness measurement functions ■ Supports 6-inch and 8-inch wafers ■ Capable of measuring up to 2000 points (Thickness measurement points can be set arbitrarily) ■ Equipped with real-time monitoring function for acquired data
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basic information
【Reference Specifications】 ■Wafer Size: 6 inches, 8 inches ■Components →Transport Unit →Loader/Unloader Unit (4 carrier installation) →Alignment Unit →ID Recognition Unit (for 8-inch glass only) →Thickness Measurement Unit →Higher-level Communication Function (optional)
Price range
P7
Delivery Time
Applications/Examples of results
We accommodate special specifications. Please feel free to contact us.
Company information
We focus on total system development, including the development and sales of semiconductor inspection equipment and software development. We take pride in our ability to provide development technical expertise, which allows us to propose development products at low prices without charging development fees. When we receive a development project, we first create an evaluation machine and proceed with development using our unique development process. By incorporating customer requests from the early stages of development and prioritizing collaboration with customers, we can offer customized products tailored to the specific requirements of our clients.
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