Ion plating device for side electrodes (compatible with surface-mounted small components)
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Dry formation of side electrodes for small electronic components (surface mount type). End face electrode deposition compatible with small components made possible by PVD (ion plating equipment).
Forming side electrodes of passive electronic components (resistors, capacitors) of the surface mount type using a dry process. A clean process that does not require waste liquid treatment. An electrode film is formed with strong adhesion only on the end faces of the components. Metal films such as Sn and Ni are formed with high throughput (also compatible with oxide film formation). We contribute to the drying and cost reduction of the production process for small electronic components, as well as stable production, through our proven hardware and unique film formation process.
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basic information
High-speed formation of electrode films with dense and strong adhesion power based on vacuum deposition using an electronic gun and a unique ionization mechanism. Adopting a horizontal type, it achieves a large processing capacity with a small installation area. The formation of electrodes, as well as the adhesion layer and bonding electrodes, are all formed together in the same vacuum chamber. Effective plasma cleaning before film formation is also carried out in the same batch. A simple device configuration enables multilayer and multi-step processing. Detailed adaptation of jigs and substrate holding methods according to component dimensions and shapes. Reliable basic hardware and customization accommodate various substrates and production lines.
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Applications/Examples of results
Formation of side electrodes for resistors Formation of electrodes for crystal oscillators Formation of side electrodes for capacitors Formation of seed layer for small-sized mounting substrates
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Company information
Shinkou Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.