Deburring of semiconductor frames, tie bar cutting, lead molding, and storage device for tubes after separation.
A device for cutting off devices from the semiconductor frame and storing them in a tube. It uses a mold with a servo press. Compatible with multi-row matrix frames. Includes brushing to remove burrs from the lead parts of the individual devices. Stored in a plastic tube.
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basic information
Supply: Slit magazine or stack magazine Storage: Plastic tube Mold drive: Servo motor Processing capacity: Reference 0.35 sec/1 device at 4×24 column frame
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Applications/Examples of results
Perform deburring, tie bar cutting, and lead forming on devices on the semiconductor frame.
Company information
We design, manufacture, and sell semiconductor inspection equipment, particularly for power semiconductors. In addition to inspection equipment, we also design and manufacture production equipment tailored to our customers' needs. We can also accommodate equipment outside of the semiconductor field. Please feel free to contact us with your requests.
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