Introducing customizable press devices for various applications such as lamination, bonding, and impregnation!
The "Mikado Vacuum Pressure Device Series" that we handle has achieved high-precision 2D pressurization (flat plate pressurization) by using a unique equal pressure system. By reducing the volume, rapid vacuuming is possible. Additionally, by adopting a heat dissipation post structure (international patent) and limiting the range of thermal influence, we have enabled uniform temperature, reduced heating and cooling times, and energy savings. It can be used for various applications including lamination, adhesion, bonding, transfer, sealing, laminating, molding, and impregnation. 【Features】 ■ Current value display and pumping pressurization are possible with a stroke sensor ■ Ensures rigidity during pressurization with a special die set structure, securely holding the load ■ By using transparent materials in part of the chamber, light energy can be irradiated during 2D or 3D pressurization ■ Chambers tailored to your requirements are available ■ The pressurization plate is detachable, improving maintainability *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Processed Samples】 ■ Heat-dissipating resin bonding ■ Resin joining ■ Resin molding ■ Wafer fixation ■ Glass lamination (OCA, OCR) ■ Sheet sealing ■ Step absorption ■ Curved surface bonding ■ Local sealing ■ Spherical bonding ■ Overflow suppression ■ Uneven surface bonding *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
**Main Applications by Field** ■ Electronic Components: Lamination, Bonding, Resin Sealing, Embedding, Smoothing, Impregnation, Green Sheet ■ Printed Circuit Boards: Lamination, Bonding, Embedded Components, Smoothing ■ FPC: Coverlay, Reinforcement Layer Bonding, Shielding Film Bonding ■ Mounting Boards: Sealing, Moisture-Proof Film Bonding ■ Semiconductors & MEMS: Au Bonding, Support Wafer Bonding, Smoothing ■ LEDs: Au Bonding, Support Wafer Bonding, Smoothing ■ Batteries: Lamination, Bonding, Smoothing ■ Touch Panels: Bonding, Curved Surface Bonding ■ Power Devices: Sintering, Heat Sink Bonding, Support Wafer Bonding ■ Optical Components: Lamination, Transfer (Imprint), Lens Bonding ■ Medical, Bio, Food: Film Lamination, Transfer, Impregnation, Molding *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Our company was founded in September 1953 in the Ina region as an early precision deep drawing press processing company, and we have already surpassed half a century. During this time, we have received the support of many customers, continuously challenging ourselves to create unique and innovative products, and have obtained numerous intellectual property rights. We have also been honored with awards such as the Good Company Award Special Prize and recognition as one of the 300 Energetic Small and Medium Enterprises. Moving forward, regardless of the field, we aim to be a valued partner by leveraging our accumulated precision press processing technology and the MIKADO brand, established through air press, vacuum press, and automation technologies, to create products that bring joy to everyone.
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