Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
The "IBOND5000" is an advanced tabletop manual wire bonding (die bonding) device used in process development, production, and research. It features an adjustable work holder height to enhance flexibility. It offers high yield and excellent reproducibility for all bonding applications, including optoelectronic modules, hybrid/MCM, microwave products, and chip-on-board. 【Product Lineup】 - Dual wire bonding device (easily switchable between wedge/ball settings) - Ball wire bonding device - Wedge wire bonding device 【Features】 - Adjustable work holder height for improved flexibility - Compatible with copper wire bonding - Ergonomically designed for ease of use - 24/7 online technical support
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【Other Features】 ■ Comprehensive solutions: machinery, tools, application development, services ■ Silver, Gold, and Platinum service plans ■ Trade-in options and rental options ■ Customized wire bonding profiles ■ Adjustable work holder height for increased flexibility ■ High yield and excellent reproducibility in all bonding applications * You can also download the PDF materials from below.
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【The Added Value of Our Wire Bonders】 ■ Over 40 years of experience in wire bonding ■ Delivery record of over 9,000 units worldwide * You can also download the PDF document from below.
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Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.
![[Information] About the bonding interface of Cu wire bonding](https://image.mono.ipros.com/public/product/image/868/2000495974/IPROS78843622833111926469.png?w=280&h=280)
![[Research Material] Global Market for Die Bonding Equipment](https://image.mono.ipros.com/public/product/image/638/2000839427/IPROS27228059363016952266.jpeg?w=280&h=280)
