Semiconductors, MEMS, liquid crystal glass, etc.! Capable of cross-section processing in micro areas and producing TEM samples.
We would like to introduce the equipment owned by Aites Co., Ltd., the Focused Ion Beam (FIB). The "FIB (Focused Ion Beam)" is a device that narrows Ga ions to less than a few micrometers and scans the beam to eject atoms from the sample surface while processing micro-regions. It is capable of cross-sectional processing of micro-regions and the production of TEM samples for semiconductors, MEMS, liquid crystal glass, build-up substrates, and more. 【Available Equipment】 ■ Crossbeam FIB "Carl Zeiss 1540XB" ■ Single Beam FIB "SEIKO SMI 2200" *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
**Features** ■ Cross Beam FIB "Carl Zeiss 1540XB" - Allows for real-time SEM observation while performing cross-sectional processing with FIB, enabling precise and pinpoint cross-sectioning. - Capable of SEM/SIM observation. ■ Single Beam FIB "SEIKO SMI 2200" - Capable of fabricating TEM samples, producing cross-sections for SIM observation, and performing fine processing. *For more details, please refer to the PDF document or feel free to contact us.*
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（6）
Download All Catalogs
Company information
Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
![<Downloadable Material> [FIB-SEM] Method for Detecting Anomalies in Plating Layers](https://image.mono.ipros.com/public/product/image/cab/2000734330/IPROS26460718384337113803.png?w=280&h=280)
![[DL Available] Cross-section preparation of micro objects (IC contact part) using FIB.](https://image.mono.ipros.com/public/product/image/db1/2000734679/IPROS95334973205447590315.png?w=280&h=280)
