Tensile and compressive stress control is possible! It can be flexibly installed to fit the space.
At Samco, Inc., we handle the plasma CVD equipment 'PD-270STLC/PD-2201LC'. The 'PD-270STLC' allows for excellent coverage during film formation at the top, middle, and bottom. Additionally, the 'PD-2201LC' can accommodate a wide range of customer requests, from simultaneous film formation of multiple small-diameter wafers using tray transport to highly uniform film formation through single wafer processing. 【Features】 <PD-270STLC> ■ SiN film formation using liquid precursor SN2 ■ Excellent coverage during film formation at the top, middle, and bottom *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Features】 <PD-2201LC> ■ Extensive film quality control ■ Compact space-saving device ■ Wafer transport via trays *For more details, please refer to the PDF materials or feel free to contact us.
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Applications/Examples of results
【Application Example】 <PD-2201LC> ■Formation of various silicon-based thin films *For more details, please refer to the PDF document or feel free to contact us.
Company information
We excel in the technology of thin film formation and processing at the nano to micro level, and we are well-regarded for providing equipment and technology for both research and development applications as well as production purposes. Additionally, we specialize in the optoelectronics field, particularly in light sources (LEDs and semiconductor lasers), which are expected to see market expansion in the future.