Attention those who cannot achieve flatness accuracy and surface roughness with grinding machines! Case study introduction.

Resolving issues such as 'the grinding machine cannot achieve flatness accuracy' and 'the surface roughness cannot be cleared' *Providing a document with points to check before making a request.

We would like to introduce a case study of a problem-solving example for polishing samples conducted by OKD. The drawing specifies a surface roughness of 0.2s and flatness of 0.005mm or less. While grinding is not feasible, we achieved this with lapping processing. Our company uses lapping machines and is open to consultations regarding flatness accuracy, surface roughness, and other requests. If you are facing issues with high precision and high quality, please feel free to contact us. 【Are you facing any of these issues?】 ■ Unable to achieve flatness accuracy with grinding machines ■ Unable to meet surface roughness requirements We will provide you with a document summarizing key points you may want to confirm before placing an order! *For more details, please refer to the PDF document or feel free to contact us.

Wafer processing/polishing equipmentProcessing Contract