Direct plating on engineering plastics (Introduction to plating application development)

We are working on the development of technology and applications to directly form smooth plating on various engineering plastic materials. We are also accommodating prototype requests.

**Features** - Currently capable of plating on polyimide (PI) and Teflon (PTFE). - PI allows for the formation of a smooth plating film. (Development of PTFE and others is ongoing) **Technical Summary** We are developing a method for ensuring adhesion between the resin and the plating film through the formation of a chemical bonding layer, rather than relying on the anchor effect from roughening. **Conventional Technology** Adhesion between the resin and the electroless plating layer is achieved through an anchor structure. **New Technology (Under Development)** Adhesion between the resin and the electroless plating layer is achieved through strong chemical bonding. **Summary of Advantages of the Technology Under Development** We aim to directly plate a smooth plating film on various resins, primarily engineering plastics. **Conventional Technology** - Adhesion Mechanism: Anchor structure - Adhesion Strength: Low strength - Applicable Materials: Limited to materials like ABS (only those that can be roughened) - Smoothness of Plated Surface: Rough (remnants of the anchor structure's unevenness) - Environmental Compliance: Use of hexavalent chromium compounds **New Technology (Under Development)** - Adhesion Mechanism: Chemical bonding - Adhesion Strength: High strength - Applicable Materials: Can be applied to various resins and ceramics - Smoothness of Plated Surface: Smooth, mirror finish possible (no anchor structure needed) - Environmental Compliance: Chromium-free

Processing Contract