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  6. High-precision plating technology for glass hermetic products (sealed terminals and connectors)

High-precision plating technology for glass hermetic products (sealed terminals and connectors)

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last updated:Mar 03, 2021

友電舎 本社、工場
友電舎 本社、工場
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With our unique cost reduction technology for materials, we can accommodate a wide range from low-cost, small-batch production to mass production.

【Features】 1. Low-cost plating treatment is possible by reducing material costs. 2. Even with electroplating, the thickness difference between the metal base and lead pins can be minimized. 3. There is less variation in film thickness due to individual differences in products. 4. A specialized plating solution that ensures wire bonding (WB) properties is used for gold plating. (Customizable depending on the project) 5. Supports multi-pins that are prone to tangling and long lead pins, as well as connectors. 6. Can accommodate difficult-to-handle small items (stem diameter φ2 and lead pin φ0.25). 7. Can also accommodate ceramic stem bases. (Plating only for lead pins)

    Processing Contract
image-case17.jpg

High-precision plating technology for glass hermetic products (sealed terminals and connectors)

image-case17.jpg
image-case17.jpg
  • Related Link - http://www.ydn.co.jp/technology/case-hermetic.html

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basic information

[Plating Specifications] (Nickel plating: base or finish) - Electrolytic nickel plating (glossy, matte) - Electroless nickel plating (Ni-p) (Gold plating finish: soft plating, for wire bonding only) - Electrolytic gold plating (Au: matte) - Electroless gold plating (Au: matte)

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Applications/Examples of results

Various glass hermetic products - Stems (for optical elements, various sensor transistors, ICs, sensors, etc.) - Connectors (for high voltage, high current, water-resistant, pressure-resistant, etc.)

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High-precision plating technology for glass hermetic products (sealed terminals and connectors).

High-precision plating technology for glass hermetic products (sealed terminals and connectors).

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友電舎

友電舎 本社、工場

Manufacturing and processing contract

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The slogan is "Challenge the Impossible." We are a technology development-oriented company that broadly develops unique surface treatment technologies to meet the special needs required for essential low-voltage components (related to electricity, electronics, and semiconductors), high-voltage components (such as high-voltage connectors), and insulating components. Additionally, we have established a support system that incorporates functional surface treatments, which we have cultivated since our founding, as our core technology, along with processes such as pressing, heat treatment, painting, and assembly. We will continue to deliver consistent Yuden-sha brand technologies and products to the world. *We support online business meetings.

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Leave it to us for high adhesion technology to ceramic materials that allows for prototype production!
Business support services
Leave it to us for high adhesion technology to ceramic materials that allows for prototype production!

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