Functional Sn plating technology (barrel plating) for fine press products.

It is an electrolytic tin plating that prevents thin plate and flat plate fine press products from sticking together.

Heat sinks, heat spreaders, and lead pins for semiconductors and various electronic components are often made from copper or iron materials that have been processed through pressing and header processing. In this case, nickel plating (Ni) is mainly used for rust prevention, while silver plating (Ag) is utilized to ensure solder wettability. On the other hand, tin plating, which is inexpensive and provides both rust prevention and wettability, is sometimes avoided because products can easily stick together, even though it would be desirable to use. Our company can provide functional Sn plating with rust prevention and solder wettability at a low cost, without worsening yield due to sticking. This is a technology for application development based on the establishment of mass production facilities tailored to customer needs.

Processing Contract