Electrolytic Ni·Pd·Au plating

Enhance secondary implementability with solder!

By providing a Pd plating layer as a barrier layer in between, the exposure of Ni to the Au surface can be more effectively controlled. Additionally, by incorporating a Pd layer, the Au plating can be made thinner, which enhances the secondary mounting capability with solder. This addresses the disadvantages of electroless Ni-Pd-Au plating. 【Disadvantages of Electroless Plating】 - Cannot achieve thick film deposition. - Material loss occurs due to liquid renewal. - Long processing time leads to poor productivity. - There are limitations on the specifications of the electroless Ni substrate. ↓ ↓ ↓ 【Electrolytic Plating】 - Processing is possible regardless of film thickness. - Low material loss results in lower running costs. - Short processing time allows for improved productivity and reduced processing costs. - No restrictions on the substrate, allowing for options beyond Ni. 【Features】 - Electrolytic Ni: No restrictions on film thickness; can accommodate non-magnetic purposes even with a Cu substrate. - Electrolytic Pd: Film thickness can be adjusted according to specifications; prevents diffusion of the underlying Ni layer due to heat resistance (barrier layer). - Electrolytic Au: No restrictions on film thickness; good WB properties and solder joint reliability; suitable for semiconductor components.

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