Fully automatic type (2 to 12 inch and square type, etc.) wafer exposure equipment
Overview Adopts a unique UV optical system optimized for high-precision exposure and a mechanism that can align photomasks and wafers with high accuracy. Fully automatic exposure equipment compatible with vacuum contact, soft contact, and proximity, with custom options available.
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basic information
Specifications Wafer: 12 inch, 6–8 inch, 4–6 inch, 2–4 inch, and square type, etc. Compatible with various sizes Work transport: CtoC, Foup Auto alignment: Top side, Back side *optional Alignment accuracy: Top side ±0.8μm or less / Back side ±1μm or less
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Applications/Examples of results
Power devices, C-MOS backside, MEMS, LED, ceramics, etc.
Company information
We will challenge the unknown world based on optics. The 21st century is said to be the "age of light," with remarkable advancements in optical technology. In our manufacturing company, we aim to accelerate future-oriented technological capabilities centered around "optical technology," actively tackling the information technology, ultra-fine technology, and scientific technology that the times require, and to be a dynamic company that acts swiftly. At the same time, we are committed to continuously promoting innovations suitable for the new century, striving to create safe and reliable products, and to remain a company that is needed by the world, actively working towards a richer society. We sincerely ask for your continued guidance and support.
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