Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
This product is an advanced tabletop dual (ball/wedge) wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It is suitable for R&D and small-scale production, equipped with a user-friendly touch panel. Bonding can be performed simply by clicking the mouse at the bonding position. Since it uses only the minimum necessary parameters, adjusting the bonding parameters is easy. 【Features】 ■ Supports copper wire bonding ■ Easy switching between wedge/ball settings ■ Adjustable work holder height for improved flexibility ■ Year-round online technical support *You can download the product documentation (PDF) from the link below.
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basic information
【Other Features】 ■ Provides high yield and excellent reproducibility for bonding applications ■ Comprehensive solutions: machinery, tools, application-specific development, services ■ Service plans (Silver, Gold, Platinum) ■ Trade-in options & rental options ■ Year-round online technical support ■ Profiles for special wire bonding * You can also download the PDF materials from below.
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【Applications】 ■ Optoelectronic modules ■ Hybrid/MCM ■ Microwave products ■ Chip on board, etc. * You can also download the PDF materials from below.
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.