Non-contact tweezers for LCOS individual chip substrates
Non-contact tweezers for LCOS individual chip substrates
Catch with air.
- By ejecting gas, it generates negative pressure through the Bernoulli effect and the ejector effect, allowing for non-contact suction, holding, and transportation of LCOS pieces. - No scratches, dirt, or pad marks will be left. - Usable in a clean room. - Suitable for breathable workpieces, perforated workpieces, and ultra-thin flexible workpieces. - Can also be used manually.
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basic information
The non-contact tweezers (patented) for LCOS substrates use manual ON/OFF operation to eject gas, allowing the workpiece to be suspended in a non-contact state and held by suction, which can then be transferred to a tray. It is also possible to invert or tilt the workpiece. Additionally, it is equipped with a high-performance filter, making it suitable for use in ultra-clean rooms. It can also transport thin, breathable workpieces such as wafers, glass substrates, lenses, optical films, and through-hole substrates.
Price information
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Delivery Time
P4
Applications/Examples of results
GaN wafers, SiC wafers, compound semiconductors, glass substrates, lenses, printed circuit boards and through-hole substrates, wafer chips.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
