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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
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  6. Pattern formation of thin films

Pattern formation of thin films

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last updated:Aug 23, 2022

東邦化研
東邦化研
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Pattern film formation is possible with a metal mask.

There are various types of patterning processes. From extremely fine patterns used in semiconductors (such as LSI and sensors) at the nano level to wiring on glass substrates at several hundred microns, and even thin film applications limited to specific areas at the centimeter level, it is possible to achieve the desired functionality by applying thin films only to the necessary areas. At Toho Kaken, we perform thin film applications to specific areas required by our customers through methods such as Metal Masks and post-etching. We can suggest masking techniques based on the type of thin film you need, the type of substrate, the patterning shape, and the shape of the application area. Please feel free to consult with us. If you have specific dimensions or drawings, it would facilitate smoother discussions. Additionally, even if you are just starting to consider your options, we welcome your inquiries.

    Printed Circuit BoardOther semiconductor manufacturing equipment
イプロス製品イメージ.jpg

Pattern formation of thin films

イプロス製品イメージ.jpg
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basic information

Pattern formation method using Metal Mask 1. Design and manufacture the mask based on the drawings received in advance. 2. Conduct incoming inspection and cleaning. 3. Set the mask made on the substrate before thin film application. 4. Apply the thin film. 5. Remove the mask. ⇒ Pattern formation completed. 6. Inspection and shipping.

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Applications/Examples of results

- Patterning process on glass substrates - Three types of wiring patterns: Au (gold), Cu (copper), Cr (chromium) - Only line patterns are formed, similar to the electrode patterns

Detailed information

  • denkyoku01-2.jpg

    This is something that has actually been processed with patterning on a glass substrate.

  • betsumaku.jpg

    The wiring width is designed to be 200μm, and the space width is 250μm. It is also possible to install several types of wiring on the same substrate.

catalog(6)

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Pattern Film Formation Technical Document

Pattern Film Formation Technical Document

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Technical Documentation on Surface Treatment Thin Film Coating

Technical Documentation on Surface Treatment Thin Film Coating

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Toho Kaken Co., Ltd. Catalog with Processing Results

Toho Kaken Co., Ltd. Catalog with Processing Results

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Ion plating method

Ion plating method

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Sputtering method

Sputtering method

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Plasma CVD method

Plasma CVD method

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Company information

東邦化研

東邦化研

Electronic Components and Semiconductors

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Our company offers contract processing (coating services) for functional thin films using ion plating, vacuum deposition, sputtering, and plasma CVD. Since our inception, we have focused on "functional thin films" such as conductivity, insulation, and corrosion resistance. We accommodate various types of films, including metal films, reactive films like oxide, carbide, and nitride films, as well as their laminated films. We have established a system to respond to a wide range of requests, from small-scale prototypes, development, and research to medium-sized production runs. Currently, we have 11 deposition devices in operation, ranging from small machines with a diameter of 300mm to inline mass production machines with a film formation area of 1000mm x 900mm. All processes, from the unboxing of substrates entrusted by customers to the packaging of the coated products, are conducted within a clean room. If you are considering functional thin films, please feel free to contact us! Based on our flexible response and over 35 years of experience, we will meet your needs! *Information about our exhibition participation is also available on our website. Please take a look.

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