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  6. High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

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Flip Chip Bonder CB-700

last updated:Mar 25, 2026

日精 本社
日精 本社
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Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

The "CB-700 (Athlete FA model)" is an all-in-one FC bonder for R&D purposes. It features an advanced interactive MMIF interface that enhances operability. With high precision (±0.5μm [3σ]) and a wide load range (0.05 to 1000N) as its foundation, it accommodates various applications and broadly meets the needs of R&D. 【Features】 ■ Extremely low load capability and high precision bonding ■ Tool lift operation utilizing high precision Z-axis control ■ Capable of ultrasonic bonding with tool exchange ■ Suitable for process development *For more details, please refer to the PDF document or feel free to contact us.

    Other semiconductor manufacturing equipmentAssembly Machine
CB700外観.png

High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

CB700外観.png
CB700外観.png
  • Related Link - https://www.nissei.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/nissei/product/

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basic information

【Specifications】 ■Supported Processes  ・ACF/ACP  ・NCF/NCP  ・Au-Sn (Eutectic)  ・Au-Au (Ultrasonic)  ・Solder Bump  ・Ag Sintering ■Mounting Accuracy: ±0.5μm ■Target Workpieces  ・Stage Size: □200mm Panel / 8-inch Wafer  ・Chip Size: 0.3 to 20mm ■Load: 0.05 to 1000N (No need to change the head depending on the load range) ■Various options available (please contact us for details) *For more information, please refer to the PDF document or feel free to contact us.

Price information

It may vary due to optional features, so please feel free to contact us.

Price range

P8

Delivery Time

Please contact us for details

※Please feel free to contact us. (Negotiable)

Applications/Examples of results

【Applications】 ■Various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ■Customized with a variety of options, provided mainly for R&D, including overseas users. *For more details, please refer to the PDF document or feel free to contact us.

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High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

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日精

日精 本社

Machine elements and parts

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We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.

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