Plating on ceramics

High electrical insulation! We would like to introduce plating technology that achieves improved performance of semiconductor devices.

Our "plating on ceramics" has high electrical insulation properties and excellent heat dissipation. There are two types of circuit formation methods: the "subtractive method," which has a flat circuit surface and excellent surface mountability, and the "semi-additive method," which allows for narrow pitch copper patterns. Plating can also be applied to through holes, and it is compatible with materials such as alumina, zirconia, and zinc oxide. 【Features】 ■ High electrical insulation ■ High thermal conductivity ■ Excellent heat dissipation ■ Low thermal expansion rate *For more details, please refer to the PDF document or feel free to contact us.

Plating EquipmentSurface treatment contract service