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  6. Small Bernoulli chuck for 5mm square wafers compatible with clean rooms.

Small Bernoulli chuck for 5mm square wafers compatible with clean rooms.

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last updated:Jan 18, 2023

ソーラーリサーチ研究所 大阪事業所
ソーラーリサーチ研究所 大阪事業所
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Adopts a mechanism that discharges exhaust upward. It picks up and transfers surrounding chips non-contact without blowing them away with the ejected gas.

At Solar Research Institute, we have developed a "cleanroom-compatible small Bernoulli chuck" that non-contactly chucks and transports micro-work chips measuring 5.0 mm square and smaller. This device generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through a pressure-type air cushion effect, allowing small cut wafer chips to be chucked in a non-contact state, floating in the air, and transported to a designated location. As part of this new mechanism, we have established a circuit to change the exhaust path around the suction pad, allowing for the alteration of the exhaust direction. Therefore, the exhaust does not blow away surrounding chips.

    WaferCVD EquipmentWafer processing/polishing equipment
□5ピンセット2.jpg

Small Bernoulli chuck for 5mm square wafers compatible with clean rooms.

□5ピンセット2.jpg
□5ピンセット2.jpg

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basic information

New Function: It picks up and transfers surrounding chips non-contact without blowing them away with ejected gas. At the Solar Research Institute, we have developed a Bernoulli chuck called the "Non-Contact Clean Chuck" for micro work chips from 5mm wafers and larger. This device generates negative pressure through the ejector effect and Bernoulli effect, as well as positive pressure through a pressure-type air cushion effect, allowing small cut wafer chips to float in the air in a non-contact state for chucking and transporting to a designated location. As a new mechanism, a circuit has been established to change the exhaust path around the suction pad, altering the exhaust direction. Therefore, the exhaust does not blow away surrounding chips. Consequently, it can be used in a clean room. ◎ Features 1. Does not blow away surrounding chips. 2. Does not eject exhaust into the surroundings. 3. Usable in a clean room. 4. Does not leave scratches or dirt on chips. 5. Does not leave pad marks on chips. ◎ Applications Wafers, wafer chips, micro lenses, micro work.

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Applications/Examples of results

1. Non-contact transport in clean rooms Wafers, liquid crystal displays, lenses Non-woven fabric, film 2. Sheet feeding device 3. Sheet inspection device 4. Non-woven fabric transport device 5. Float chuck

Company information

ソーラーリサーチ研究所

ソーラーリサーチ研究所 大阪事業所

Electronic Components and Semiconductors

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Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.

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