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  4. Semiconductor Manufacturing Equipment
  5. Bonding Equipment
  6. Wide Area Fully Automatic Thick Wire Bonder 'BJ985'

Wide Area Fully Automatic Thick Wire Bonder 'BJ985'

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last updated:Aug 17, 2021

ヘッセ・メカトロニクス・ジャパン
ヘッセ・メカトロニクス・ジャパン
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Wide work area! Built-in non-destructive testing pull test function for wires and ribbons.

The "BJ985" is a new generation fully automatic fine wire bonder, developed for various automotive components such as substrates, chips, batteries, and other products. Switching from aluminum wire to copper wire can be done in just a few minutes with a bond head replacement. In addition to the standard configuration, we propose the most suitable automatic transport system for your application. 【Features (partial)】 ■ Bond head: 50pm - 600pm, compatible with aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized pattern recognition: Adoption of a new digital camera and flash lighting ■ Wedge calibration without the need for a wedge gauge ■ High-precision programmable bond force actuator *For more details, please refer to the PDF document or feel free to contact us.

    Bonding Equipment
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Wide Area Fully Automatic Thick Wire Bonder 'BJ985'

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  • Related Link - https://www.hesse-mechatronics.com/produkte/dickdr…

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【Other Features (Partial)】 ■Hesse Assist Tool (Optional): ・E-Box: Visual bond head adjustment support (patented) Programmable position adjustment marks for wedge, cutter, and wire guide ・Automatic bond force calibration: Prevents operational errors and ensures a stable process through load cells ・Innovative bond tool detection ・Wire spool detection ■Detailed loop programming configurable for each individual loop ■Use of wear-free components with piezo technology ■Maintenance-free solid-state joints ■Bond head preset with EEPROM *For more details, please refer to the PDF materials or feel free to contact us.

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Wide Area Fully Automatic Thick Wire Bonder 'BJ985'

Wide Area Fully Automatic Thick Wire Bonder 'BJ985'

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ヘッセ・メカトロニクス・ジャパン

ヘッセ・メカトロニクス・ジャパン

Industrial Machinery

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Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.

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