Silicone-free high-performance thermal conductive material * Thermal design column and comparison test data available.
Adopted by the supercomputer "Fugaku"! Reducing electrical contact failures! Introducing a silicone-free, high-performance thermal interface material that does not generate low molecular weight siloxanes!
"Cosmo Thermal Grease" and "Cosmo Thermal Gap Filler" are high-performance thermal materials with excellent heat resistance and high thermal conductivity. Since they do not use silicone-based materials, there is no concern about contact failure due to low molecular siloxane. Please choose between grease and gap filler (hardened type) according to your application. "Cosmo Thermal Grease" is a non-silicone thermal material that can be spread thinly up to several tens of micrometers, reducing thermal resistance. It is used in many fields, including computer CPUs, wireless base stations, office multifunction devices, car navigation systems, and home appliances. "Cosmo Thermal Gap Filler" is a hardened thermal paste. It can be controlled to any thickness, resulting in less stress on components. You can choose between a one-component heat-curing type and a two-component room-temperature curing type. ★ You can download test data comparing thermal effects. ★ You can also download the "Thermal Design Column" written by Naoki Kunimine, the representative director of Thermal Design Lab. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
**Features of Cosmo Thermal Grease** - Excellent conformity to application surfaces, demonstrating effective thermal conductivity. - Soft and can be spread thinly, resulting in less stress on components. - Does not use silicone-based materials, eliminating concerns about contact failure due to low molecular siloxane. **Lineup** - SF102: Thin film, low viscosity - SF121: Thin film, heat-resistant - SF311: Medium thermal conductivity, low viscosity - SF401: High thermal conductivity, medium viscosity - SF431: High thermal conductivity, pump-out resistant - SF501: High thermal conductivity, medium viscosity - SF601: High thermal conductivity, low viscosity **Features of Cosmo Thermal Gap Filler** - Silicone-free - Can conform to complex uneven shapes over a wide application area, demonstrating effective thermal conductivity. - Can be controlled to any thickness, resulting in minimal stress on components. - No concerns about pump-out after curing, similar to sheets. - Excellent repairability after curing. **Lineup** - CGS3501: Single-component heat-curing type - CGT3001: Two-component room temperature curing type *For more details, please refer to the PDF document or feel free to contact us.*
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Applications/Examples of results
【Adoption Results】 ■ Supercomputer "Fugaku" ■ PC CPU ■ Car navigation system ■ In-vehicle LED lights ■ Projector ■ Industrial inverter, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Cosmo Oil Lubricants conducts integrated research, development, manufacturing, and sales of various products, primarily focusing on lubricants, within the Cosmo Energy Group. Additionally, we are putting significant effort into the development and sales of thermal interface materials, and our unique thermal interface products, which apply lubricant development technology, are already being used by many customers. We will respond to future market needs in lubricants and thermal interface materials while also pursuing new developments centered around lubricant technology.
![[Series Volume 4] Thermal Design Consultant Naoki Kunimine's Column](https://image.mono.ipros.com/public/product/image/24b/2000841741/IPROS86466095253875529367.png?w=280&h=280)
![[Technical Data Presentation] Heat Dissipation Material for EV Onboard Lithium-Ion Batteries](https://image.mono.ipros.com/public/product/image/5c1/2000772509/IPROS07266405853192923684.jpeg?w=280&h=280)
