This is an introduction to a case that clearly shows the area ratio that can be cleaned has reached 92%!
Here is a case study on the mechanism of silicon wafer cleaning. By utilizing the characteristic of ultra-fine bubbles that creates high pressure inside, we experimentally verified the effect of removing fine particles from solid surfaces using pressure waves. It was revealed that fine particles larger than 1 micron were removed and became unobservable, and that the area ratio of the cleaned surface reached 92%. 【Cleaning Effect】 ■Before cleaning: 359–472 µm² ■After ultrapure water cleaning: 320–482 µm² ■After ultrapure water jet + ultra-fine bubble cleaning - 1000x image: 28.65 µm² - 3000x image: 37.33 µm² *For more detailed information about the case study, please refer to the related link. For further inquiries, feel free to contact us.
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Our main business is the design of specialized machine tools for processing automotive parts and similar items. We have been researching microbubbles since 2000. In 2006, we developed a loop flow microbubble generation nozzle. We applied for a patent, which was published in May 2008. Since spring 2008, we have been supplying a special type to a company that sells ozone microbubble shower devices. General sales began in 2009.
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