Stable quality is a characteristic! Introducing the properties of "alumina" and "silica" as well as the polishing targets!
Our company conducts slurry development and manufacturing based on the experience we have cultivated since our founding. "CMP slurry" is composed of chemical solutions and nano-sized abrasive particles, characterized by minimal generation of coarse particles and good particle dispersion, ensuring stable quality. We offer "alumina," which provides excellent cleaning properties and a fast polishing rate, and "silica," which achieves damage-free results with high surface roughness. 【Features】 <Alumina> ■ Properties: Excellent cleaning properties and fast polishing rate ■ Polishing targets: Resins, compound ceramics <Silica> ■ Properties: Damage-free with high surface roughness ■ Polishing targets: Oxide films, metal film resins, glass *For more details, please refer to the PDF document or feel free to contact us.
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Kitagawa Gresstech Co., Ltd. was established through the merger of System Seiko Co., Ltd. and Kemet Japan Co., Ltd. By combining the technology cultivated by System Seiko in HDD polishing equipment with the know-how developed by Kemet Japan in polishing consumables and contract processing for semiconductors and electronic components, we aim to strengthen our sales and development capabilities and further expand our business.