Interface adhesion analysis and next-generation adhesive bonding technology
ISBN978-4-86043-796-1
A unique book that analyzes and evaluates adhesive interfaces in three-dimensional and complex ways using a new method, summarizing adhesive interface phenomena in spacetime across different scales.
Various attempts to identify factors leading to destruction and degradation are explained. The development of new adhesives applying new analysis techniques for adhesive bonding interfaces and a detailed explanation of next-generation adhesive bonding technologies are also provided!
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basic information
"Analysis of Adhesive Interfaces and Next-Generation Adhesive Bonding Technology" ■Format: B5 size, 448 pages ■Price: 54,000 yen + tax ■Author: Nobu Horiuchi ■Publisher: NTS Introduction: Interfacial Phenomena in Adhesion and Bonding Part 1: Analysis and Evaluation Methods for Adhesive Bond Interfaces Chapter 1: Analysis of Adhesive Interfaces Chapter 2: Simulation Analysis of Adhesive Interfaces Chapter 3: Evaluation Methods for Adhesive Bond Properties Part 2: Development of Adhesives and Next-Generation Adhesive Bonding Technology Chapter 1: Development of Novel Adhesives Chapter 2: Development of Reversible Adhesives Chapter 3: Next-Generation Adhesive Bonding Technology Chapter 4: Industry-Academia Collaboration and International Trends in Adhesive Bonding Technology
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List price: 54,000 yen + tax
Price range
P2
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P2
Applications/Examples of results
Interface simulation analysis Dissimilar material adhesives Conductive adhesives High-strength polyurethane adhesives Modified silicone resin adhesives Biological tissue adhesives Hybrid structural adhesives Next-generation high-speed communication FPC-compatible low-dielectric adhesive films Dismantlable adhesives Repetitive adhesion Development of reversible adhesives Dental adhesives Adhesive technology for multi-material structures
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