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  6. Observation of the metal structure of wire (spring material) using DL/EBSD.

Observation of the metal structure of wire (spring material) using DL/EBSD.

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last updated:Oct 07, 2023

セイコーフューチャークリエーション
セイコーフューチャークリエーション
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Observing metal microstructures with EBSD allows for smooth consideration of material selection and changes.

Electron Backscatter Diffraction Pattern (EBSD) allows for the following when combined with a Scanning Electron Microscope (SEM): - Separation of phases with different crystal systems - Distribution ratio and crystal orientation analysis for each separated phase In this case, we introduce "metal microstructure observation of wire (spring material) using EBSD." We investigated the changes in metal microstructure during the processing of spring material (drawing with a diameter of Φ1.00mm and 0.07mm) and confirmed that the metal microstructure changes after drawing. This measurement technique is very useful for selecting metal materials and comparing during material changes. We encourage you to give it a try. Additionally, our company conducts various cross-sectional analyses using TEM and surface analysis using XPS, allowing for multifaceted analytical assessments. Both sales and technical staff are available to assist directly, so please feel free to consult with us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/

    Other metal materialsOther microscopesContract measurement
新case_1811d-線材の金属組織観察(SEM-EBSD測定).png

Observation of the metal structure of wire (spring material) using DL/EBSD.

新case_1811d-線材の金属組織観察(SEM-EBSD測定).png
新case_1811d-線材の金属組織観察(SEM-EBSD測定).png
  • Related Link - https://www.seiko-sfc.co.jp/analysis-service/case.…

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As a result of the analysis, the following was confirmed: - The metal structure after drawing has been refined. - The crystal orientation has changed after drawing, indicating the formation of a structure suitable for spring materials.

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Observation of the metal structure of wire (spring material) using EBSD.

Observation of the metal structure of wire (spring material) using EBSD.

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セイコーフューチャークリエーション

セイコーフューチャークリエーション

Testing, Analysis and Measurement

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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.

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