The electron backscatter diffraction method (EBSD) is useful for evaluating the performance of aluminum sputter films and selecting substrate materials.
Electron Backscatter Diffraction Pattern (EBSD) can be combined with Scanning Electron Microscopy (SEM) to enable the following: ● Measurement of the shape and orientation of micro-regions of crystal grains ● Confirmation of the orientation of crystals relative to a reference orientation ● Measurement of internal strain in materials from information on crystal orientation differences In this case, we introduce "Evaluation of Aluminum Sputter Films Using EBSD." This measurement technique is useful for evaluating the performance of aluminum sputter films and for substrate selection. It can also be applied to ceramic materials if there is orientation evaluation and crystallinity. We encourage you to give it a try. In addition to EBSD and SEM, our company also conducts various cross-sectional analyses using TEM and surface analysis using XPS, allowing for multifaceted analytical evaluations. Both sales and technical staff are available to assist directly, so we would appreciate it if you could feel free to consult with us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/
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The analysis results indicate that the difference in substrate materials strongly affects the orientation of the aluminum sputter film.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.
![[Data DL available/EBSD] Measurement of internal strain in wire materials](https://image.mono.ipros.com/public/product/image/3bb/2000765564/IPROS99353283314693742529.png?w=280&h=280)
![[EBSD] Electron Backscatter Diffraction Method](https://image.mono.ipros.com/public/product/image/bef/387108007/IPROS4688397342881936146.jpg?w=280&h=280)
