By confirming the shape changes of the metal structure and measuring internal strain using EBSD, it is possible to determine whether the bending processes of leaf springs, hair springs, and others are appropriate.
Electron Backscatter Diffraction Pattern (EBSD) allows for the following when combined with a Scanning Electron Microscope (SEM): - Analysis of crystal orientation after cross-section formation - Confirmation of shape changes in metal microstructures and internal strain distribution In this case, we introduce "internal strain measurement of wire materials" using EBSD. This measurement technique is useful for determining whether bending processes, such as those for leaf springs and hair springs, are appropriate and for setting processing conditions. We encourage you to give it a try. Additionally, our company conducts various cross-sectional analyses using TEM and surface analysis using XPS, enabling multifaceted analytical evaluations. Both sales and technical staff are available to assist directly, so we would be grateful if you could feel free to consult with us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/
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basic information
As a result of the analysis, the following was confirmed: - The metal structure is deformed before and after the bending process. - In the wire after bending, the crystal orientation difference has increased, and the internal strain has become larger.
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Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.
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