Plating treatment that utilizes thermal conductivity, electrical conductivity, and ductility.
Characteristics of Copper Plating - Good electrical conductivity Copper plating, which uses copper, achieves high electrical conductivity similar to that of copper itself (resistivity ρ×10^-8(Ω·m) 1.6 to 2.3, conductivity (%IACS) 75.0 to 107.8). Leveraging its excellent electrical conductivity, it is particularly active in the field of electrical equipment. - High thermal conductivity In addition to electrical conductivity, copper also excels in thermal conductivity. The thermal conductivity of copper is 0.94 [W/m·℃, allowing heat to be distributed quickly and evenly throughout the material. - Ideal as a base plating Copper plating is also valued as a base plating. For example, when it is necessary to plate materials that are difficult to plate directly, applying copper plating first as a base can improve adhesion to the material. Additionally, it provides uniformity, making it useful for the purpose of smoothing the surface of the substrate. - Polishing possible after plating Copper plating can also be buff polished after plating. By performing buff polishing as a finishing touch, it is possible to achieve a higher gloss. Buff polishing also expands the variety of decorative options.
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basic information
Copper plating, which is now widely used in both decorative and industrial fields, tends to be used as a base in the decorative field due to the inherent properties of copper that make it prone to discoloration and susceptible to corrosion when exposed to oxygen-containing water. On the other hand, in the industrial field, it has been extensively used in applications such as printed circuit boards and electronic circuits because of its thermal conductivity, electrical conductivity, and ductility. Even though it is referred to simply as copper plating, there are different types based on the methods used, and currently, the four main types of copper plating are copper sulfate plating, copper fluoroborate plating, cyanide copper plating, and copper pyrophosphate plating. Incidentally, these four types of copper plating can be broadly classified into two categories: acidic and alkaline.
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Applications/Examples of results
Printed circuit boards, automotive electronic components, thick coating for gravure printing, plating on plastic, thick coating on the bottom of frying pans.
Company information
We perform plating processing on components used in various industries, including semiconductor parts, satellite parts, ship parts, and food-related components. Our strength lies in our high technical skills, which are a result of our thorough quality management system! We often receive comments from customers such as, "The quality of Sanwa Plating Industry is very trustworthy." We aspire to be a company that contributes to solving the challenges of businesses across Japan by leveraging the technology we possess. Additionally, as a company philosophy, we value the idea of considering the entire company as one family.
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