Substrate bias mechanism! Introducing our microwave PECVD/etching equipment.
The "scia Cube 300/450/750" is a microwave PECVD/etching device compatible with substrates of 300×300mm, 450×450mm, and 750×750mm. The processes include microwave PECVD and reactive ion etching (RIE). Please feel free to consult us when you need assistance. 【Features】 ■ Compatible with substrates of 300×300mm, 450×450mm, and 750×750mm ■ Substrate bias mechanism ■ Substrate cooling and heating mechanism (-10 to 850℃) *For more details, please refer to the PDF materials or feel free to contact us.
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【Applications】 ■ PECVD: Insulating films (Si3N4, SiO2, etc.) ■ Optical materials (a-C:H, DLC) ■ Nanocrystalline diamond, carbon nanotubes ■ RIE: Reactive etching (Ni, Cr, Pt, etc.) ■ Optical materials (quartz, fused silica, etc.) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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